Samsung is reportedly in the process of reworking its 6th-generation 1c DRAM, aiming to boost yield rates and secure a competitive advantage for its upcoming HBM4 technology.
The 1c DRAM chip is poised to be a critical component in Samsung’s HBM4 process and overall memory business strategy. The tech giant is contemplating a significant overhaul of this chip, recognizing its importance to the successful implementation of HBM4. Reports from ZDNet Korea indicate that Samsung has been reassessing its advanced DRAM plans since the latter half of 2024. The company is now revising its high-end 1c DRAM to smooth the way for industry adoption of its new HBM processes. This stands in contrast to the challenges faced with the integration of HBM3 versions, which encountered significant hurdles with major players like NVIDIA.
The report highlights that Samsung’s innovative DRAM process initially fell short of its yield rate goals, which were pegged at roughly 60%-70%. This shortfall hindered Samsung from moving into full-scale production. A key issue appears to be the dimensions of the 1c DRAM chip. Initially, Samsung aimed to reduce the chip size to increase output, a move that ultimately compromised process stability and led to diminished yield rates.
Samsung Electronics has now pivoted, altering the design of its 1c DRAM to boost chip size with a renewed focus on enhancing yields, hoping to hit its targets by mid-year. The emphasis seems to be on achieving stable mass production of their next-generation memory, accepting higher costs as a trade-off if necessary, according to ZDNet Korea.
The 1c DRAM’s evolution is vital for the success of Samsung’s HBM4 products. With competitors like SK Hynix and Micron having already fine-tuned their designs, Samsung is feeling the pressure of the ticking clock. The company must overcome its tarnished reputation following the HBM3 debacle to ensure the 1c DRAM process meets industry expectations.
Currently, there’s some uncertainty around the outcome of Samsung’s 6th-generation DRAM process. However, it is expected that significant developments will emerge in the coming months, potentially aligning Samsung’s HBM4 process for mass production by year’s end.
